The new Bosch semiconductor plant is built on a site measuring some 100,000 square meters – about the size of 14 soccer fields – in Dresden’s ‘Silicon Valley’. The company will primarily manufacture microchips for cars here on an assembly line in the digitized and highly networked semiconductor factory. The project involved the construction of the extremely vibration-resistant fabrication building (FAB), a support building (SUP), a central energy supply (CUB) and a state-of-the-art office building. The high-availability electrical power and refrigeration systems, as well as various generation plants ^{Erzeugungsanlagen gemeint?} for the high-purity media, gases and chemicals needed to produce semiconductor elements were built and commissioned in a fast-track construction process. The 10,000 square meter clean room was built and taken into operation in less than six months.

The construction process was controlled using Lean Construction Management (LCM®). This allowed precise coordination of the team of some 40 construction managers, schedulers and commissioning staff.